Display device including a sensing signal transmitter and a sensing signal receiver

ABSTRACT

A display device includes a display area including pixels and a non-display area adjacent to the display area. A circuit layer is disposed on the display area and the non-display area. A light emitting layer is disposed in the display area and includes a light emitting element defining the pixels. A transmitter is disposed on the circuit layer in the non-display area and transmits a sensing signal. A receiver is disposed in the display area separated from the transmitter and receives the sensing signal. A pixel control circuit for controlling the light emitting element is disposed in the circuit layer in the display area. A driving control circuit is disposed in the circuit layer in the non-display area. The driving control circuit is electrically connected to the transmitter.

This application is a continuation of U.S. application Ser. No.16/406,253, filed on May 8, 2019 in the U.S. Patent and TrademarkOffice, which claims priority under 35 U.S.C. § 119 from, and thebenefit of, Korean Patent Application No. 10-2018-0055790, filed on May16, 2018, in the Korean Intellectual Property Office, the contents ofboth of which are herein incorporated by reference in their entireties.

1. Technical Field

Exemplary embodiments of the present invention relate to a displaydevice, and more particularly, to a display device including a sensingsignal transmitter and a sensing signal receiver.

2. Discussion of Related Art

A video display device such as a smart phone may include a display unitdisplaying an image, and a peripheral unit in which a sensing elementand various driving elements are disposed. A size of the peripheral unitmay be reduced to increase the size of the display unit displaying theimage. Accordingly, studies have been conducted on methods of increasingthe size of the display unit and reducing the size of the peripheralunit.

SUMMARY

An exemplary embodiment of the present invention provides a displaydevice in which the size of a display unit for displaying an image isincreased.

According to an exemplary embodiment of the present invention, a displaydevice includes a substrate including a display area including pixelsand a non-display area adjacent to the display area. A circuit layer isdisposed on the display area and the non-display area. A light emittinglayer is disposed in the display area and includes a light emittingelement defining the pixels. A transmitter is disposed on the circuitlayer in the non-display area and transmits a sensing signal. A receiveris disposed in the display area separated from the transmitter andreceives the sensing signal. A pixel control circuit for controlling thelight emitting element is disposed in the circuit layer in the displayarea. A driving control circuit is disposed in the circuit layer in thenon-display area. The driving control circuit is electrically connectedto the transmitter.

According to an exemplary embodiment of the present invention, a displaydevice includes a substrate including a display area including pixelsand a non-display area adjacent to the display area. A light emittinglayer is disposed in the display area and includes a light emittingelement defining the pixels. A transmitter is disposed in thenon-display area and transmits a sensing signal. A receiver is disposedin the display area spaced apart from the transmitter. The receiverreceives the sensing signal. The light emitting layer includes a guideopening overlapping the receiver and transmitting the sensing signal.

According to an exemplary embodiment of the present invention, a displaydevice includes a substrate including a display area and a non-displayarea adjacent to the display area. A plurality of pixels are definedabove the substrate. A circuit layer is disposed on the substrate. Alight emitting layer is disposed on the circuit layer in the displayarea. A transmitter is disposed on the circuit layer in the non-displayarea. The transmitter is configured to transmit an infrared (IR) sensingsignal to a target object. A receiver is disposed in the circuit layer.The receiver is configured to receive the IR sensing signal reflected bythe target object.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the present invention willbecome more apparent by describing in detail exemplary embodimentsthereof with reference to the attached drawings, in which:

FIG. 1 is a schematic view of a display device according to an exemplaryembodiment of the present invention;

FIG. 2 is a plan view of a transmitter, a receiver, and a controller inthe display device of FIG. 1;

FIG. 3 is a rear view of a transmitter, a receiver, and a controller inthe display device of FIG. 1;

FIG. 4 is a cross-sectional view taken along line IV-IV′ of FIG. 2;

FIG. 5 is a view of a light emitting element and a receiver in a regionA of FIG. 2;

FIG. 6 is a cross-sectional view taken along line VII-VII′ of FIG. 5.

FIGS. 7 to 9 are views of operations of a display device according to anexemplary embodiment of the present invention;

FIGS. 10 and 11 are views of a display device according to an exemplaryembodiment of the present invention;

FIG. 12 is a view of a display device according to an exemplaryembodiment of the present invention;

FIG. 13 is a view of a display device according to an exemplaryembodiment of the present invention;

FIG. 14 is a view of a display device according to an exemplaryembodiment of the present invention;

FIGS. 15 and 16 are views of a display device according to an exemplaryembodiment of the present invention;

FIGS. 17 and 18 are views of a display device according to an exemplaryembodiment of the present invention; and

FIG. 19 is a view of a display device according to an exemplaryembodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. In thisregard, the exemplary embodiments may have different forms and shouldnot be construed as being limited to the exemplary embodiments of thepresent invention described herein. Like reference numerals may refer tolike elements throughout the specification and drawings.

As used herein, the singular forms “a”, “an” and “the” may include theplural forms as well, unless the context clearly indicates otherwise.

It will be understood that when a component, such as a layer, a layer, aregion, or a plate, is referred to as being “on” another component, thecomponent may be directly on the other component or interveningcomponents may be present.

It will be understood that although the terms “first” and “second” maybe used herein to describe various components, these components shouldnot be limited by these terms.

FIG. 1 is a schematic view of a display device according to an exemplaryembodiment of the present invention.

Referring to FIG. 1, a display device 1 may include a display area PAand a non-display area NPA adjacent to the display area PA. As anexample, the non-display area NPA may be arranged at four sides of thedisplay area PA in a plan view; however, exemplary embodiments of thepresent invention are not limited thereto. For example, the non-displayarea NPA may be arranged at less than four sides (e.g., three sides) ofthe display area PA in a plan view.

The display area PA may include a plurality of pixels PX. As an example,the pixels PX may be spaced apart from each other or may be immediatelyadjacent to each other. The pixels may be arranged in a plurality ofrows and columns on or above an underlying substrate. Thus, the pixelsPX may be arranged in a matrix configuration. Each pixel PX may displaya particular color. For example, the plurality of pixels PX may includeR pixels for displaying red, G pixels for displaying green, and B pixelsfor displaying blue. Further, the R pixels, the G pixels, and the Bpixels may be alternately arranged to implement various colors. However,exemplary embodiments of the present invention are not limited thereto,and the pixels PX may display different colors from those describedabove.

The display area PA may be formed, for example, in a rectangular shape.However, exemplary embodiments of the present invention are not limitedthereto, and the display area PA may also have a shape such as a square,a circle, and an ellipse.

A non-display area NPA may be disposed around the display area PA. Thenon-display area NPA is an area where no image is displayed, and forexample, a light blocking member such as a black matrix may be disposedtherein. In an exemplary embodiment of the present invention, thenon-display area NPA may include a bezel part of the display device 1.

In an exemplary embodiment of the present invention, the non-displayarea NPA may be disposed only on an outer short side of the display areaPA, and in an exemplary embodiment of the present invention, thenon-display area NPA may also be disposed only on an outer long side ofthe display area PA (e.g., in a display device having a rectangularshape). As an example, the non-display area NPA may be disposed only onone outer side of the display area PA.

In the non-display area NPA, various driving elements for driving thepixels PX may be disposed. The pixels PX may be located in thenon-display area NPA, but the pixels PX located in the non-display areaNPA may be dummy pixels that are not visually recognized from theoutside.

FIG. 2 is a plan view of a transmitter, a receiver, and a controller inthe display device of FIG. 1. FIG. 3 is a rear view of a transmitter, areceiver, and a controller in the display device of FIG. 1.

Referring to FIGS. 2 and 3, the display device 1 may include atransmitter 700 (Tx) transmitting a sensing signal and a receiver 800(Rx) receiving a sensing signal transmitted from the transmitter.

The transmitter 700 may be disposed in the non-display area NPA of thedisplay device 1. The transmitter 700 can be controlled by a controller80 (Cont) disposed in the non-display area NPA of the display device 1.In an exemplary embodiment of the present invention, the controller 80and the transmitter 700 may be electrically connected to each otheralong a connection line CL extending along the non-display area NPA. Thecontroller 80 may also be directly connected to the transmitter 700, andthus the connection line CL may be omitted.

In an exemplary embodiment of the present invention, a part of theconnection line CL electrically connecting the controller 80 and thetransmitter 700 may be disposed in the display area PA. In this case,the connection line CL may use some of lines arranged in the displayarea PA.

Although the controller 80 and the transmitter 700 may be spaced apartfrom each, exemplary embodiments of the present invention are notlimited thereto, and the controller 80 may be disposed immediatelyadjacent to the transmitter 700.

In an exemplary embodiment of the present invention, the controller 80may include a driver IC for driving a light emitting element disposed inthe display area PA. For example, the controller 80 may drive thetransmitter 700 and may substantially simultaneously drive the lightemitting element disposed in the display area PA.

The receiver 800 may be disposed in the display area PA of the displaydevice 1.

The receiver 800 may be disposed on an opposite side of the displaydevice 1 from the transmitter 700. For example, when the transmitter 700is disposed on an upper surface of the display device 1, the receiver800 may be disposed on a lower surface of the display device 1. As anexample, the receiver 800 may be positioned adjacent to a firstrelatively shorter side of the display device 1 in the display area PAand the transmitter 700 may be disposed in the non-display area NPA at asecond relatively shorter side of the display device 1 opposite thefirst relatively shorter side of the display device 1.

In an exemplary embodiment of the present invention, the receiver 800may be disposed adjacent to the transmitter 700 (e.g., immediatelyadjacent to the transmitter 700), thus increasing speed and sensingefficiency of the display device 1. For example, when the transmitter700 is disposed in a non-display area NPA of the display device 1, thereceiver 800 may be disposed in an area adjacent to (e.g., immediatelyadjacent to) the transmitter 700 in the display area PA.

In an exemplary embodiment of the present invention, the transmitter 700and the receiver 800 may perform infrared ray (IR) sensing. For example,the transmitter 700 may transmit an IR sensing signal, and the receiver800 may receive an IR sensing signal transmitted from the transmitter700 and reflected on a target object. However, exemplary embodiments ofthe present invention are not limited thereto, and many modificationsfor transmitting and receiving the sensing signal may be applied to thetransmitter 700 and the receiver 800.

FIG. 4 is a cross-sectional view taken along line IV-IV′ of FIG. 2.

Referring to FIG. 4, the display device 1 may include a window 100, alight transparent bonding member 110, a touch member 200, anencapsulation layer 300, a light emitting layer 400, a circuit layer500, and a substrate 600.

The substrate 600 may include the display area PA and the non-displayarea NPA. The light emitting layer 400 and the receiver 800 may bedisposed in the display area PA of the substrate 600 and the transmitter700 may be disposed in the non-display area NPA.

The substrate 600 may include a transparent material such as glass or aflexible material. Thus, the substrate 600 may be substantiallytransparent. An example of such a flexible material may be a plasticmaterial. For example, the substrate 600 may include a material selectedfrom Kapton, polyethersulfone, polycarbonate, polyimide, polyethyleneterephthalate (PET), polyethylene naphthalate (PEN), polyacrylate (PAR),fiber reinforced plastic (FRP), and the like.

According to an exemplary embodiment of the present invention, thedisplay device 1 may be a bendable or foldable display device that is ina curved or bent state at some times and is in a substantially flatstate at other times. Alternatively, the display device 1 may be in apermanently folded, curved or bent state.

In an exemplary embodiment of the present invention, the substrate 600may have a thickness of 500 μm to 200 μm. The thickness of the substrate600 may be maintained at 200 μm or less to maintain a flexiblecharacteristic of the substrate 600 and the thickness of the substrate600 may be maintained at 5 μm or more to stably support the lightemitting layer 400.

The circuit layer 500 may be disposed over the display area PA and thenon-display area NPA. For example, the circuit layer 500 maycontinuously extend from the display area PA to the non-display areaNPA.

The circuit layer 500 disposed in the display area PA may include apixel control circuit 501 for controlling the light emitting elementdisposed in the light emitting layer 400. Examples of such a pixelcontrol circuit 501 include a thin layer transistor, a capacitor, andvarious lines for electrically connecting the thin layer transistor andthe capacitor to an external circuit. The pixel control circuit 501 willbe described in more detail below.

In an exemplary embodiment of the present invention, the pixel controlcircuit 501 may be electrically connected to a controller 80 (see, e.g.,FIG. 2). In this case, the controller 80 may serve as a driver ICdriving the light emitting element disposed in the light emitting layer400.

The circuit layer 500 disposed in the non-display area NPA may include adriving control circuit 502 for driving the transmitter 700. An exampleof such a driving control circuit may include a thin layer transistorand a line 570 for electrically connecting the thin layer transistor andthe transmitter 700. In an exemplary embodiment of the presentinvention, such a driving control circuit 502 may also be electricallyconnected to the controller 80. In this case, the controller 80 mayserve as a controller controlling an operation of the transmitter 700while serving as a driver IC driving the light emitting element disposedin the light emitting layer 400.

The light emitting layer 400 may be disposed on the display area PA ofthe circuit layer 500. The light emitting layer 400 may include a lightemitting element that defines a pixel PX (see, e.g., FIG. 1) of thedisplay device 1. In an exemplary embodiment of the present invention,such a light emitting element may include an organic light emittingdevice. However, exemplary embodiments of the present invention are notlimited thereto, and a type of the light emitting element that definesthe pixel PX of the display device 1 may be modified, as desired. Forexample, when the light emitting layer 400 includes the organic lightemitting device, the transmitter 700 may include an inorganic LED.

The encapsulation layer 300 may be disposed on the light emitting layer400 of the display area PA. The encapsulation layer 300 maysubstantially cover the light emitting layer 400, and may protect thelight emitting layer 400 from external moisture. The encapsulation layer300 may include a single or multilayer layer including an inorganiclayer or a laminated layer in which inorganic layers and organic layersare alternately laminated.

The touch member 200 may be disposed on the encapsulation layer 300 ofthe display area PA. The touch member 200 might only be disposed in thedisplay area PA and might not be disposed in the non-display area NPA.The touch member 200 may acquire position information of an input pointby a capacitive method, a resistive layer method, an electromagneticinduction method, or an infrared method, for example.

The window 100 may be disposed on the upper portion of the touch member200. For example, the window 100 may be positioned on a side of thetouch member 200 that is opposite the light emitting layer 400. Thewindow 100 may substantially cover and protect the touch member 200 andcomponents included in or below the touch member 200. The window 100 maybe disposed over the display area PA and the non-display area NPA. Forexample, the side of the window 100 may protrude from the touch member200 on the plane.

The window 100 may include a transparent material. Thus, the window 100may be substantially transparent. The window 100 may include, forexample, glass or plastic. When the window 100 includes plastic, thewindow 100 may have a flexible characteristic.

Examples of the plastic applicable to the window 100 are not limitedthereto, but may include polyimide, polyacrylate, polymethylmethacrylate(PMMA), polycarbonate (PC), polyethylenenaphthalate (PEN),polyvinylidene chloride, polyvinylidene difluoride (PVDF), polystyrene,ethylene vinylalcohol copolymer, polyethersulfone (PES), polyetherimide(PEI), polyphenylene sulfide (PPS), polyallylate, triacetyl cellulose(TAC), or cellulose acetate propionate (CAP). Thus, the window 100 maybe a plastic window and may include at least one of the plasticmaterials listed above.

When the window 100 includes plastic, the window 100 may further includecoating layers disposed on the upper and lower surfaces of the plastic.In an exemplary embodiment of the present invention, the coating layermay be a hard coating layer including an organic layer and/or anorganic-inorganic complex layer including an acrylate compound, forexample. The organic layer may include an acrylate compound. Theorganic-inorganic complex layer may be a layer in which an inorganicmaterial such as silicon oxide, zirconium oxide, aluminum oxide,tantalum oxide, niobium oxide, or glass beads is dispersed in an organicmaterial such as an acrylate compound. In an exemplary embodiment of thepresent invention, the coating layer may include a metal oxide layer.The metal oxide layer may include metal oxides such as titanium,aluminum, molybdenum, tantalum, copper, indium, tin or tungsten, butexemplary embodiments of the present invention are not limited thereto.

The light transparent bonding member 110 may be disposed between thewindow 100 and the touch member 200. The window 100 and the touch member200 may be bonded to each other by the light transparent bonding member110.

The transmitter 700 transmitting a sensing signal may be disposed on thenon-display area NPA of the circuit layer 500. The transmitter 700 maybe electrically connected to the driving control circuit 502 via, forexample, a contact pad 710.

The receiver 800 may be disposed on a lower surface of the substrate 600of the display area PA. For example, the receiver 800 may be disposed ona sub substrate 810 fixed to the lower surface of the substrate 600through a first adhesive layer 830 and a fixing member 820. As anexample, the receiver 800 may be positioned at an opposite side of thesubstrate 600 from the light emitting layer 400. The receiver 800 may bespaced apart from the bottom surface of the substrate 600, thus formingan open space between the substrate 600 and the receiver 800.

In an exemplary embodiment of the present invention, the receiver 800 isnot electrically connected to the circuit layer 500 and might not becontrolled by the controller 80 (see, e.g., FIG. 1). The receiver 800may be electrically connected to a circuit board 900. The receiver 800may be fixed to the lower portion of the sub substrate 810 by a secondadhesive layer 910.

As an example, the light emitting layer 400 may include an organic lightemitting device. The receiver 800, the substrate 600, the circuit layer500, the light emitting layer 400, and the encapsulation layer 300 willbe described in more detail in more detail below.

FIG. 5 is a view of a light emitting element and a receiver in a regionA of FIG. 2. FIG. 6 is a cross-sectional view taken along line VII-VII′of FIG. 5.

Referring to FIG. 5, the receiver 800 may be disposed on the lowersurface of the substrate 600, and may have a cross-sectional area largerthan that of one organic light emitting device 480. For example, thereceiver 800 may be disposed to overlap a plurality of organic lightemitting devices 480. Accordingly, the receiver 800 may receive thesensing signal through a region where the organic light emitting device480 is not disposed. The receiver 800 and the organic light emittingdevice 480 will be described in more detail below

Referring to FIG. 6, the circuit layer 500 (see, e.g., FIG. 4) disposedon the substrate 600 may include a buffer layer 520, a gate insulatinglayer 540, an interlayer insulating layer 545, and a planarization layer560.

The buffer layer 520 may be disposed on the substrate 600. The bufferlayer 520 may prevent impure elements from penetrating the substrate 600may planarize a surface thereof. The buffer layer 520 may include oneof, for example, a silicon nitride (SiN_(x)) layer, a silicon oxide(SiO₂) layer, or a silicon oxynitride (SiO_(x)N_(y)) layer. However, thebuffer layer 520 may be. For example, the buffer layer 520 may beomitted according to a type of substrate 600 and device manufacturingprocess conditions.

The semiconductor layer 530 may be disposed on the buffer layer 520. Thesemiconductor layer 530 may include any one of a polycrystalline siliconlayer (Poly Si), an amorphous silicon layer (Amorphous Si), or an oxidesemiconductor such as indium-gallium-zinc oxide (IGZO) or indium zinctin oxide (IZTO). For example, when the semiconductor layer 530 includesthe polycrystalline silicon layer, the semiconductor layer 530 mayinclude a channel region 534 in which impurities are not doped, and asource region 532 and a drain region 536 formed by doping impurities onboth sides of the channel region.

The types of impurities doped into the source region 532 and the drainregion 536 may vary depending on a type of the driving transistorsincluded in the display device 1. In an exemplary embodiment of thepresent invention, a P-type transistor doped with P-type impurities maybe used in the source region 532 and the drain region 536 as the drivingtransistors, but exemplary embodiments of the present invention are notlimited thereto.

The gate insulating layer 540 may be disposed between the semiconductorlayer 530 and the gate electrode 550. The gate insulating layer 540 mayinclude an insulating layer. For example, the gate insulating layer 540may include at least one of silicon nitride (SiN_(x)) or silicon oxide(SiO₂). In an exemplary embodiment of the present invention, the gateinsulating layer 540 may include a multilayer structure including adouble-layer layer or a single layer.

The gate electrode 550 may be disposed on the gate insulating layer 540.The gate electrode 550 may extend in a direction to be connected to agate line. The gate electrode 550 may be disposed to overlap the channelregion 534. The gate electrode 550 may include at least one of, forexample, molybdenum (Mo), chrome (Cr), tungsten (W), titanium (Ti), orcopper (Cu). In addition, a first electrode of a capacitor may bedisposed on the gate insulating layer 540.

The interlayer insulating layer 545 may be disposed on the gateelectrode 550. The interlayer insulating layer 545 may be disposed tocompletely cover the gate electrode 550. The interlayer insulating layer545 may include silicon nitride (SiN_(x)), silicon oxide (SiO_(x)), ortetraethoxysilane (TEOS), but exemplary embodiments of the presentinvention are not limited thereto.

A data line including a source electrode 552 and a drain electrode 554may be disposed on the interlayer insulating layer 545. A secondelectrode of the capacitor may be disposed on the interlayer insulatinglayer 545. The source electrode 552 and the drain electrode 554 may eachinclude a multilayer layer of a double layer or more, and an interlayerinsulating layer 545 may be disposed between the respective layersthereof.

The source electrode 552 and the drain electrode 554 may be connected tothe source region 532 and the drain region 536 through via holes formedin the gate insulating layer 540 and the interlayer insulating layer545, respectively. Vias may be formed in via holes so that the sourceelectrode 552 and the drain electrode 554 may be connected to the sourceregion 532 and the drain region 536, respectively.

The drain electrode 554 may be connected to a pixel electrode 482 of theorganic light emitting device 480 through a via formed in theplanarization layer 560.

According to an exemplary embodiment of the present invention, the pixelcontrol circuit 501 may be disposed on the planarization layer 560. Theinterlayer insulating layer 545 may be disposed adjacent to the lightemitting layer 400 on the planarization layer 560. The receiver 800 maybe disposed in the insulating layer.

The driving transistors 530 and 550 may provide a driving signal to thepixel electrode 482 to emit a light providing layer 484 of the organiclight emitting device 480 defining the pixel PX (see, e.g., FIG. 1).

For example, a voltage corresponding to a difference between a datavoltage supplied from a data line and a common voltage supplied from acommon power supply line may be stored in a capacitor, and a drivecurrent corresponding to the voltage stored in the capacitor may run tothe organic light emitting device 480 through driving transistors (e.g.,530 and 550) to emit light in the organic light emitting device 480. Thesemiconductor layer 530 and the gate electrode 550 may each operate asdriving transistors, and may each be interchangeably referred to asdriving transistors herein.

The planarization layer 560 may be disposed on the interlayer insulatinglayer 545 to cover the source electrode 552 and the drain electrode 554.The planarization layer 560 may remove and planarize a step to increaseemission efficiency of the organic light emitting device 480 to bedisposed thereon. The planarization layer 560 may include at least onematerial of, for example, a polyacrylates resin, an epoxy resin, aphenolic resin, a polyamides resin, a polyimides resin, an unsaturatedpolyesters resin, a polyphenylenethers resin, a polyphenylenesulfidesresin, or benzocyclobutene (BCB).

The pixel control circuit 501 (see, e.g., FIG. 4) may include, forexample, the driving transistors 530 and 550, the source electrode 552,the drain electrode 554.

The light emitting layer 400 (see, e.g., FIG. 4) disposed on thesubstrate 600 may include a pixel defining layer 470 and the organiclight emitting device 480.

The pixel electrode 482 of the organic light emitting device 480 may bedisposed on the planarization layer 560. The pixel electrode 482 may beelectrically connected to the drain electrode 554 through a via formedin the planarization layer 560.

The pixel defining layer 470 may be disposed to expose a part of thepixel electrode 482. The pixel defining layer 470 may define a pixel PXand the pixel electrode 482 may be disposed to correspond to a positionof the pixel PX by the pixel defining layer 470.

The pixel defining layer 470 may include a resin such as polyacrylatesor polyimides.

The light providing layer 484 may be disposed on the pixel electrode 482and a common electrode 486 may be disposed on the pixel defining layer470 and the light providing layer 484. The light providing layer 484 mayinclude a relatively low molecular organic material or a relatively highmolecular organic material. The light providing layer 484 may include ahole injection layer (HIL) and a hole transporting layer (HTL) disposedadjacent to the pixel electrode 482. The light providing layer 484 mayinclude an electron transporting layer (ETL) and an electron injectionlayer (EIL) disposed adjacent to the common electrode 486.

In an exemplary embodiment of the present invention, the pixel electrode482 may be a reflective electrode and the common electrode 486 may be atransmissive electrode or a transflective electrode. Accordingly, thelight generated in the light providing layer 484 may be provided in adirection of the common electrode 486.

For example, transparent conductive oxide (TCO) may be used for forminga transmissive electrode. Examples of the transparent conductive oxide(TCO) may include indium tin oxide (ITO), fluorine doped tin oxide(FTO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum doped ZnO(AZO), gallium doped ZnO (GZO), boron-doped ZnO (BZO), or indium oxide(In₂O₃). In addition, metal nanowires and carbon nanomaterials may alsobe used (e.g., for forming a transmissive electrode). For example,silver nanowires (Ag—NW), carbon nanotubes, carbon nanowires, fullerene,or graphene may be used (e.g., for forming a transmissive electrode).

In addition, for forming the transflective electrode, a metal such asmagnesium (Mg), silver (Ag), gold (Au), calcium (Ca), lithium (Li),chromium (Cr), aluminum (Al), or copper (Cu) or alloys thereof may beused. By controlling the thickness of the electrode, the commonelectrode 486 may be formed as the transflective electrode. As thethickness of the transflective electrode becomes thinner, thetransmittance of light increases, but the resistance increases. Inaddition, the thicker the thickness, the lower the transmittance oflight.

Further, the transflective electrode may include a multilayer structureincluding a metal layer including a metal or a metal alloy and atransparent conductive oxide (TCO) layer laminated on the metal layer.

The encapsulation layer 300 (see, e.g., FIG. 4) disposed on thesubstrate 600 may include inorganic layers 310 and 330, and an organiclayer 320. In an exemplary embodiment of the present invention, theencapsulation layer 300 may include the inorganic layers 310 and theorganic layer 320 alternately laminated. As an example, the inorganiclayers 310 and 330 and the organic layer 320 may be alternately andrepeatedly laminated, such as to include a plurality of each of theinorganic layers 310 and 330 and the organic layer 320.

A lower inorganic layer 310 may be disposed nearest to the organic lightemitting device 480. For example, the lower inorganic layer 310 may bein direct contact with the common electrode 486.

The lower inorganic layer 310 may include at least one of inorganicmaterials such as Al₂O₃, TiO₂, ZrO, SiO₂, AlON, AlN, SiON, Si₃N₄, ZnO,or Ta₂O₅. The lower inorganic layer 310 may be formed by a method suchas chemical vapor deposition (CVD) or atomic layer deposition (ALD).Accordingly, the lower inorganic layer 310 may be conformally disposedaccording to the shape of the common electrode 486. An upper inorganiclayer 330 may include a same material as the lower inorganic layer 310.

The organic layer 320 may include a polymer-based material. Thepolymer-based material may include an acrylic resin, an epoxy resin,polyimide, or polyethylene, for example. The organic layer 320 may beformed through a thermal deposition process. The thermal depositionprocess for forming the organic layer 320 may be performed within atemperature range without damage to the organic light emitting device480.

The inorganic layers 310 and 330 in which the density of the thin layeris relatively densely formed may reduce or eliminate the permeation ofmoisture or oxygen.

A sensing operation of the display device 1 will be described in moredetail below with reference to FIGS. 7 to 9.

FIGS. 7 to 9 are views of operations of a display device according to anexemplary embodiment of the present invention.

Referring to FIG. 7, first, a sensing signal SS transmitted from thetransmitter 700 may be reflected to a target object 1000 and may beincident to the display device. The sensing signal SS incident to thedisplay device may be received by the receiver 800 disposed below thesubstrate 600 through the window 100, the touch member 200, theencapsulation layer 300, the light emitting layer 400, the circuit layer500, and the substrate 600. In an exemplary embodiment of the presentinvention, since the window 100, the touch member 200, the encapsulationlayer 300, the circuit layer 500, and the substrate 600 may each includea transparent material that transmits light, the sensing signal SS maybe received by the receiver 800 by passing through the window 100, thetouch member 200, the encapsulation layer 300, the circuit layer 500,and the substrate 600.

Referring to FIGS. 8 and 9, when the sensing signal SS passes throughthe light emitting layer 400, the sensing signal SS may be received tothe receiver 800 by passing through a peripheral area AA of the lightemitting element 480 defining the pixel PX. In the drawing, althoughonly the R light emitting element 480 is illustrated as an example, thesensing signal SS may pass through the peripheral region AA of the Blight emitting element 480 and/or the G light emitting element 480.

In an exemplary embodiment of the present invention, when only thetransmitter 700 of the sensing element is disposed in the non-displayarea NPA of the display device 1, as compared with the case where boththe transmitter 700 and the receiver 800 are arranged in the non-displayarea NPA, the size of the sensing element disposed in the non-displayarea NPA may be reduced. Therefore, it is possible to reduce an area inthe non-display area NPA and to increase the size of the display areaPA. Thus, a display device according to an exemplary embodiment of thepresent invention may include a relatively large display area PA and arelatively small non-display area NPA.

FIGS. 10 and 11 are views of a display device according to an exemplaryembodiment of the present invention. Descriptions of components that arethe same or substantially the same as those described above may beomitted below, and thus differences from the exemplary embodiments ofthe present invention described above may be focused on below.

Referring to FIGS. 10 and 11, a display device 2 may include a guideopening 1050 which vertically overlaps the receiver 800 inside the lightemitting layer 400. Such a guide opening 1050 may be disposed in anadjacent region of the light emitting element 480.

In an exemplary embodiment of the present invention, the light emittingelement 480 adjacent to the region in which the guide opening 1050 isdisposed may be relatively small, but exemplary embodiments of thepresent invention are not limited thereto.

The guide opening 1050 may guide the sensing signal SS (see, e.g., FIG.7) transmitted from the transmitter 700 to be received by the receiver800. As described with reference to FIG. 8 above, the sensing signal SS(see, e.g., FIG. 7) can reach the receiver 800 by passing through theperipheral area AA of the light emitting element 480, but thetransmittance may vary depending on the material characteristic of thelight emitting layer 400. Accordingly, when such a guide opening 1050 isdisposed in the light emitting layer 400, the operational reliability ofthe receiver 800 can be increased regardless of the materialcharacteristics of the light emitting layer 400.

In an exemplary embodiment of the present invention, the guide openings1050 may be disposed in a trench shape including an empty space. In thiscase, some of the components (for example, the pixel defining layer 470described with reference to FIG. 6) of the light emitting layer 400 maydefine a side wall of the guide opening 1050. As an example, the guideopening 1050 may completely penetrate the light emitting layer 400.

In an exemplary embodiment of the present invention, the guide opening1050 may be substantially filled with a transparent material. Forexample, the guide opening 1050 may be substantially filled with atransparent material that may better transmit the sensing signal SS (seeFIG. 7) than the light emitting layer 400. Alternatively, the guideopening 1050 might not be filled with any material.

Descriptions of technical features described herein according to oneexemplary embodiment of the present invention may be applicable to otherexemplary embodiments of the present invention, and thus duplicativedescriptions may be omitted herein. For example, the description of thetechnical features of the guide opening 1050 above may be similarlyapplicable a guide opening according to an exemplary embodiment of thepresent invention described below.

FIG. 12 is a view of a display device according to an exemplaryembodiment of the present invention.

Referring to FIG. 12, a guide opening 1070 disposed inside the lightemitting layer 400 of a display device 3 may extend to the circuit layer500 by passing through the light emitting layer 400.

In an exemplary embodiment of the present invention, the guide opening1070 may be substantially filled with a transparent material. Forexample, the guide opening 1070 may be substantially filled with atransparent material that may better transmit the sensing signal SS(see, e.g., FIG. 7) than the light emitting layer 400 and the circuitlayer 500.

FIG. 13 is a view of a display device according to an exemplaryembodiment of the present invention.

Referring to FIG. 13, a guide opening 1100 disposed inside the lightemitting layer 400 of a display device 4 may be substantially filledwith the encapsulation layer 300. The guide opening 1100 may be formedby forming a trench in the light emitting layer 400 and substantiallyfilling the guide opening 1100 with the encapsulation layer 300 in theprocess of forming the encapsulation layer 300.

FIG. 14 is a view of a display device according to an exemplaryembodiment of the present invention.

Referring to FIG. 14, a guide opening 1200 disposed inside the lightemitting layer 400 and the circuit layer 500 of a display device 5 maybe substantially filled with the encapsulation layer 300. The guideopening 1200 may be formed by forming a trench in the circuit layer 500and light emitting layer 400 after forming the circuit layer 500 and thelight emitting layer 400 and substantially filling the guide opening1200 with the encapsulation layer 300 in the process of forming theencapsulation layer 300.

FIGS. 15 and 16 are views of a display device according to an exemplaryembodiment of the present invention.

Referring to FIGS. 15 and 16, a guide openings 1300 disposed inside thelight emitting layer 400 of a display device 6 may be disposed in atleast one hole shape. The guide opening 1300 may be formed by removingadjacent areas of the light emitting element 480.

In an exemplary embodiment of the present invention, the guide openings1300 may have a hole shape with an empty space therein. The guideopening 1300 may be formed by forming holes having a relatively smalldiameter in the light emitting layer 400 using a laser and covering theencapsulation layer 300 on the light emitting layer 400.

If the guide opening 1300 is formed in the hole shape and has arelatively small diameter, the encapsulation layer 300 might not bearranged to fill the guide opening 1300. Thus, the guide opening 1300may be left as an empty space that is not filled by the encapsulationlayer 300.

In an exemplary embodiment of the present invention, the guide opening1300 may be substantially filled with a transparent material (e.g., amaterial other than the encapsulation layer 300). For example, the guideopening 1300 may be substantially filled with a transparent materialthat may better transmit the sensing signal SS (see, e.g., FIG. 7) thanthe light emitting layer 400. Alternatively, the guide opening 1300 maybe filled with the encapsulation layer 300.

In an exemplary embodiment of the present invention, the guide opening1300 may extend into the circuit layer 500. For example, the guideopening 1300 may completely penetrate the circuit layer 500.

FIGS. 17 and 18 are views of a display device according to an exemplaryembodiment of the present invention.

Referring to FIG. 17, the receiver 800 of a display device 7 may bedisposed in the circuit layer 500. For example, in an exemplaryembodiment of the present invention, the transmitter 700 may be disposedon the upper surface of the substrate 600, and the receiver 800 may bedisposed on the lower surface of the substrate 600. However, in anexemplary embodiment of the present invention, the transmitter 700 andthe receiver 800 may both be disposed on the upper surface of thesubstrate 600.

As an example, referring to FIG. 18, the circuit layer 500 of thedisplay device 7 may further include an insulating layer 580 disposed onthe planarization layer 560 and having the receiver 800 formed therein.The receiver 800 may be disposed in an area that does not overlap thepixel electrode 482 in a vertical direction with respect to an uppersurface of the substrate 600.

In an exemplary embodiment of the present invention, the receiver 800may be, for example, a photodiode sensing an infrared signal transmittedfrom an infrared transmitter.

In an exemplary embodiment of the present invention, the insulatinglayer 580 may include an organic layer, but exemplary embodiments of thepresent invention are not limited thereto. For example, the insulatinglayer 580 may include an inorganic layer.

According to an exemplary embodiment of the present invention, a displaydevice may include a substrate (e.g., substrate 600) including a displayarea (e.g., display area PA) and a non-display area (e.g., non-displayarea NPA) adjacent to the display area. A plurality of pixels PX may bedefined above the substrate. The circuit layer 500 may be disposed onthe substrate. The light emitting layer 400 may be disposed on thecircuit layer 500 in the display area. The transmitter 700 may bedisposed on the circuit layer 500 in the non-display area. Thetransmitter 700 may be configured to transmit an infrared (IR) sensingsignal to a target object (e.g., target object 1000 described withreference to FIG. 7). The receiver 800 may be disposed in the circuitlayer 500. The receiver 800 may be configured to receive the IR sensingsignal reflected by the target object.

According to an exemplary embodiment of the present invention, thecircuit board 900 may be electrically connected to the receiver 800. Thecircuit board 900 may be configured to control an operation of thereceiver 800 or may receive a signal from the receiver 800.

According to an exemplary embodiment of the present invention, the lightemitting layer 400 may include a guide opening (e.g., guide opening 1400described in more detail below with reference to FIG. 19) overlappingthe receiver 800 and transmitting the IR sensing signal to the receiver800 through the guide opening.

According to an exemplary embodiment of the present invention, the guideopening may include a plurality of holes penetrating the light emittinglayer 400. Thus, the guide opening may completely penetrate the lightemitting layer 400 to reach the receiver 800.

FIG. 19 is a view of a display device according to an exemplaryembodiment of the present invention.

Referring to FIG. 19, the light emitting layer 400 of a display device 8may include a guide opening 1400 that facilitates the transmission of asensing signal to an area that vertically overlaps the receiver 800disposed in the circuit layer 500.

As an example, the guide opening 1400 may be formed in a hole shape toextend from the light emitting layer 400 to the circuit layer 500;however, exemplary embodiments of the present invention are not limitedthereto. For example, the shape of the guide opening 1400 may bemodified by any of the above-described shapes of the guide openings.

The guide opening 1400 may be substantially filled with theencapsulation layer 300; however, exemplary embodiments of the presentinvention are not limited thereto. The guide opening 1400 may besubstantially filled with a transparent material or may be left as anempty space.

As described above, according to an exemplary embodiment of the presentinvention, since only the transmitter of the sensing element is disposedin the non-display area, the size of the sensing element disposed in thenon-display area may be smaller than that in the case where thetransmitter and the receiver are disposed in the non-display area.Therefore, it is possible to reduce an area in the non-display area andrelatively increase the size of the display area.

While the present invention has been shown and described with referenceto the exemplary embodiments thereof, it will be apparent to those ofordinary skill in the art that various changes in form and detail may bemade thereto without departing from the spirit and scope of the presentinvention.

What is claimed is:
 1. A display device comprising: a substrateincluding a display area and a non-display area, the substrate includinga first surface and a second surface opposite to the first surface; alight emitting layer disposed in the display area and disposed on thefirst surface of the substrate, the light emitting layer including alight emitting element; and a first sensing member disposed in thedisplay area and receiving a sensing signal, the first sensing memberdisposed on the second surface of the substrate, wherein the lightemitting layer includes a guide opening overlapping the first sensingmember, and transmitting the sensing signal.
 2. The display device ofclaim 1, further comprising: a circuit layer disposed in the displayarea and the non-display area, the circuit layer disposed between thefirst surface of the substrate and the light emitting layer, wherein theguide opening extends from the light emitting layer to the circuitlayer.
 3. The display device of claim 2, further comprising: a secondsensing member disposed in the non-display area and transmitting thesensing signal.
 4. The display device of claim 3, wherein the secondsensing member is disposed on the circuit layer disposed in thenon-display area, and wherein the second sensing member is electricallyconnected to a line of the circuit layer.
 5. The display device of claim1, wherein the guide opening includes a plurality of holes, and whereinat least two of the plurality of holes overlap the first sensing member.6. The display device of claim 1, wherein the guide opening includes aplurality of holes, and wherein an occupied area of a hole of theplurality of holes is smaller than an occupied area of the first sensingmember in a plan view.
 7. The display device of claim 1, wherein thelight emitting element overlaps the first sensing member.
 8. The displaydevice of claim 7, wherein the light emitting element does not overlapthe guide opening.
 9. The display device of claim 1, wherein the lightemitting element is provided in a plural, and wherein a first lightemitting element and a second light emitting element adjacent to thefirst light emitting element overlap the first sensing member.
 10. Thedisplay device of claim 9, wherein the guide opening includes aplurality of holes, and wherein a hole of the plurality of holes isdisposed between the first light emitting element and the second lightemitting element in a plan view.
 11. The display device of claim 1,further comprising: an encapsulation layer disposed on the lightemitting layer, wherein the encapsulation layer overlaps the guideopening.